Residue free electrically conductive material

ABSTRACT

A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

The present application is a divisional of and claims priority to U.S.patent application Ser. No. 16/991,222 filed Aug. 12, 2020, which inturn is a continuation-in-part of U.S. patent application Ser. No.15/986,292, filed May 22, 2018, which in turn claims the benefit of andpriority to prior filed Provisional Application Ser. No. 62/510,629,filed May 24, 2017, all of such priority applications being expresslyincorporated herein by reference.

RIGHTS OF THE GOVERNMENT

The invention described herein may be manufactured and used by or forthe Government of the United States for all governmental purposeswithout the payment of any royalty.

FIELD OF THE INVENTION

The disclosure is directed to electrically conductive materials, inparticular to polymer encapsulated liquids that are electricallyconductive, circuit components containing the polymer encapsulatedliquids, and methods for making the polymer encapsulated, electricallyconductive materials.

BACKGROUND AND SUMMARY

The recent surge in flexible and stretchable electronics (FSE) researchand development has compelled researchers to develop materials andprocesses that are well-suited toward the advancement of FSE technology.Flexible and stretchable electronics are complete electronic circuitsthat have the ability to undergo reversible deformation whilemaintaining their intended functionality.

There are numerous commercial applications for FSE circuits. Electronicmaterials that can be printed with small feature size and highly tunableproperties without the requirement of aggressive post-processing areapplicable to flexible electronics in the consumer electronics market aswell as health and sports health monitoring markets to name a few, whereproducts are required to be printed quickly (roll-to-roll fashion) andin high throughput with reliable functional operation parameters.Printing of electrical contacts pads, flip-chip bump bonding forintegrated circuits, flexible integrated antennas, among other uses arequickly identifiable.

Current state-of-the-art approaches to fabricating conductors which cansurvive elastic stretching involve an “island-plus-serpentine” approachwherein rigid (non-stretching) electrical components are connectedelectrically using meandering (serpentine) solid metal interconnects. Byemploying this type of curved geometry to fabricate the deviceinterconnects, localized strains are drastically reduced resulting in anoverall device elasticity that far exceeds that of the conducting metalsin their bulk form. Though the island-plus-serpentine approach hasindeed met with a certain degree of success, several limitations havefostered continued research into alternative options. For instance,serpentine patterns require more “real estate” in the device layout,higher stretching can only be achieved where interconnects are notbonded to the substrate, and interconnects are prone to failure afterrepeated stretching cycles.

Conductive liquids offer an unprecedented level of mobility and agilityin the field of reconfigurable electronics. There are a variety ofconducting fluids available, ranging from highly conductive liquidmetals to more resistive metal colloid loaded dielectric fluids, andeven include ionic conductive fluids. However, these conductive fluidsneed to be contained within channels or vascular structures, andindividual droplets will coalesce with one another due to surface energyminimization and Laplace pressure gradients, limiting their structurallydictated electromagnetic properties.

One of the most useful electrically conductive fluids are gallium basedalloys. However, gallium based alloys form a thin oxide shell on thesurface of the metal that hinders mechanical reconfigurability. Thisoxidation creates contamination issues in a device due to the fact thatthe liquid metal oxide adheres to many surfaces leaving a residuebehind. The formation of residue has led to many devices requiring theuse of a corrosive (acidic/basic) environments to lessen the effects ofthe oxide. While this approach has been experimentally proven, the useof acidic/basic environments leads to corrosion of the metallicinterfaces as well as alloying between that of the liquid metal andsurrounding metallic contacts. As a result, there is a need for asolution that allows liquid metal devices to avoid such effects withoutcompromising the advantage of being reconfigurable.

In view of the foregoing, embodiments of the disclosure provide adeformable yet mechanically resilient microcapsule having electricalproperties, a method of making the microcapsules, and a circuitcomponent including the microcapsules. The microcapsule containing agallium liquid metal alloy core having from about 60 to about 100 wt.%gallium and at least one alloying metal, and a polymeric shellencapsulating the liquid core, said polymeric shell having conductiveproperties.

In one embodiment, there is provided a method for making deformablemicrocapsules containing a gallium liquid metal alloy core. The methodincludes the steps of (1) providing a double-T-junction apparatus havinga first T-junction and a second T-junction; (2) flowing at a rate ofabout 0.1 mL/Hr a gallium liquid metal alloy emulsion to the firstT-junction containing a first aqueous carrier fluid to form firstdroplets in the first aqueous carrier fluid at a rate of about 100mL/Hr; (3) flowing at a rate of about 0.1 mL/Hr the first droplets tothe second T-junction containing an emulsion of a polymerizable materialin a second carrier fluid flowing at a rate of about 100 mL/Hr to formsecond droplets containing the first droplets as a core and thepolymerizable material as a shell; and (4) polymerizing thepolymerizable material to provide the deformable microcapsulescontaining the gallium liquid metal alloy core, wherein the shell of thedeformable microcapsules has conductive properties.

A further embodiment provides a deformable circuit component havingelectrical properties. The circuit component has an electrical elementcontaining microcapsules having electrical properties. The microcapsulescontain a gallium liquid metal alloy core having from about 60 to about85 wt.% gallium and at least one alloying metal, and a polymeric shellencapsulating the liquid core, wherein the polymeric shell hasconductive properties.

In some embodiments, the gallium liquid metal alloy is a gallium andindium alloy. The gallium indium alloy may also contain tin.Accordingly, in some embodiments, the gallium liquid metal alloy mayinclude about 62 wt.% to about 95 wt.% gallium; about 5 wt.% to about 22wt.% indium; and about 0 wt.% to about 16 wt.% Sn.

In other embodiments, the alloying metal of the gallium liquid metalalloy may be selected from tin, silver, gold, thalium, cesium,palladium, platinum, sodium, selenium, lithium, potassium, zinc, copper,cadmium, bismuth, indium, antimony, lead, and combinations of two ormore of the foregoing.

In some embodiments, the deformable microcapsule has a polymeric shellthickness ranging from about 10 to about 20 microns and a core volumeranging from about 50 to about 200 microliters. The deformablemicrocapsule may have a mean particle diameter ranging from about 100 μmto about 1 mm.

In some embodiments, the polymeric shell of the deformable microcapsulemay be coated with an electrically conductive material.

In other embodiments, the polymeric shell may be made of a polymerizablematerial selected from poly(alkyl-methacrylate), polysiloxane,polyurethane, poly(aniline), polypyrrole, polythiophene,poly(ethylenedioxythiophene), and poly(p-phenylene vinylene), whereinthe polymerizable material contains a conductive material component.

The foregoing embodiments are described in more detail below and mayovercome challenges of using flexible circuit materials by encapsulatingthe liquid metal within a polymer shell. The polymeric shell beingelastic will provide mechanical resiliency while providing a protectivelayer against conducive fluid coalescence. For applications requiringelectrically intimate contact, the polymeric shell may be electricallyconductive. For applications where the contact is required to beionically conductive, the elastomer of the polymeric shell may be chosento be ionically conductive. Most conductive polymers, especially undermechanical stress, exhibit lower conductivity compared with conductivefluids. Therefore, the encapsulation of a liquid conductor within a thinconductive polymeric shell provides a superior material solution toapplications that require a mechanical resiliency and conductivity,compared with a conductive elastomeric polymer devoid of a liquid metalcore.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic illustration of a double T-Junction for use inmaking deformable microcapsule having electrical properties.

DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS

In hopes of achieving a more elegant, versatile, and robust solution tostretchable conductors, researchers have been examining eutectic blendsof Gallium-Indium (eGaIn) and Gallium-Indium-Tin (GaInSn) in earnest asthese room temperature liquid metal alloys are inherently stretchable,are non-toxic, and have excellent conductivity. Several groups havealready begun to explore the use of Gallium liquid metal alloys (GaLMAs)in multiple FSE applications including strain gauges, stretchablecapacitors, reconfigurable antennas, and self-healing circuits.

Embodiments of the disclosure provide a method to encapsulate a GaLMAliquid conductor within a conductive elastomeric shell. The elastomericshell may be formed by means of core-shell microfluidic encapsulationprocess. The encapsulation process involves linear channels such thatone channel will confine the core material (in this case the liquidGaLMA), one channel will contain the shell material (pre-curedelastomer), and another channel will surround the core material with theshell material and carry the core-shell droplet to a curing area. Theforegoing procedure is very similar to that shown in FIG. 1 .

In FIG. 1 , a double T-Junction 10 in operation is viewed from the top,looking down. Channel 12 provides a core material such as GaLMA from acore material source 14 through T-Junction 1 to channel 16 containing asource 18 of aqueous fluid. T-Junction 1 causes the formation ofdiscrete particles 20 of GaLMA to form in the aqueous fluid by adjustingthe flow of the aqueous fluid releative to the flow of GaLMA intoT-Junction 1. The outlet of T-Junction 1 provides an aqueous streamcontaining the discrete particles 20 of GaLMA for continuous flow toT-Junction 2. The continuous fluid becomes the dispersed fluid as itflows through T-Junction 2 into channel 22. A source of shell materialin an organic carrier fluid is provided from conduit 24 to the channel22 so that it encapsulates the discrete particles of GaLMA from channel16 as the combined material emerges as a shell and core material 26 fromT-Junction 2 into channel 22. The shell and core material 26 then flowsto a curing area 28 where excess shell material and/organic carrierfluid is removed and the shell of the shell and core material 26 iscured.

All three channels 12, 16 and 22 can be perpendicular to one another andthese channels, with their respective material, can have flow rates thatcause the formation of the discrete particles 20 of GaLMA in channel 16and the encapsulated particles 26 in channel 22. The flow rates will bedetermined such that the rate enables the core material (GaLMA) 20 toenter the shell material (polymeric elastomer) channel 22 but only partway so that the core material 20 is sliced into sections that will besurrounded and carried by the shell material 24 through theencapsulating channel 22.

For example, the flow rate of gallium liquid metal alloy forming thecore material to T-Junction 1 may range from about 0.05 to about 0.115mL/Hr. The aqueous carrier fluid 18 for the gallium liquid metal alloyin channel 16 may have a flow rate ranging from about 80 mL/Hr to about120 mL/Hr. The aqueous carrier fluid may also contain an oxide reducingcompound such as NaOH to prevent the formation of an oxide coating onthe gallium liquid metal alloy. As set forth above, the oxide coating onthe gallium liquid metal alloy may cause corrosion problems if the corematerial were to escape from the shell material. However, in otherembodiments, the gallium liquid metal alloy may also contain an oxidecoating.

The polymerizable material in channel 22, forming the shell of thecore/shell microcapsule, may be provided in a second carrier fluid toT-Junction 2. Accordingly, the flow rate of polymerizable material 24 inthe second carrier fluid may range from about 80 mL/Hr to about 120mL/Hr. The second carrier fluid may be selected from a wide variety oforganic solvents, including but not limited to, toluene, xylene,ethanol, propanol, and the like. An organic material that is readilyevaporated or removed from the cured microcapsules is particularlypreferred.

The resulting core/shell material 26 and carrier fluid in channel 22 mayhave a combined flow rate ranging from about 160 mL/Hr to 200 mL/Hr. Thecuring area 28 may be an extension of the carrier material channel 22 oran external containing area that will also have the carrier material.The curing area 28 may be heated as to thermally cure the elastomericshell or illuminated with radiation to provide photo-initiated curing.The cured core-shell droplets are collected and further used to makeexpandable and deformable electrical circuit components. Because of thepolymeric shell material, corrosion of metal surfaces and electricalcontacts by the oxide coating may be avoided when using the encapsulatedGaLMA in electrical devices and circuits.

The electrical properties of the GaLMA/microcapsule core/shell materialsmay be adjusted over a wide range by selecting different conductivepolymeric materials used to form the shell of the microcapsule or bycoating the microcapsules with conductive or resistive materials.Accordingly, the polymeric shell material may be selected frompoly(alkyl-methacrylate), polysiloxane, polyurethane, poly(aniline),polypyrrole, polythiophene, poly(ethylenedioxythiophene), andpoly(p-phenylene vinylene). The polymeric shell may have a shellthickness ranging from about 10 to about 20 microns and a mean particlediameter ranging from about 100 μm to about 1 mm. The core volume of themicrocapsule may range from about 50 to about 200 microliters.

The encapsulation process uses two main components: a flow source suchas a syringe pump, peristaltic pump, or other continuous-throughputpumping system and a double-T platform 10 to create core-shell droplets.The platform 10 can be made from a variety of materials. One example isa transparent polymer polydimethylsiloxane (pdms). The channel geometryis made into a mold, from this mold a pdms casting can be made in theform of the negative of the mold. This casting can be bonded to a flatsubstrate such as glass via oxygen plasma functionalization. The flowsources can then be connected to their respective channels.

In order to improve the properties of the GaLMA materials so that theyremain electrically conductive, the GaLMA materials are disposed in apolymeric microcapsule that has electrical properties. Accordingly, thecured shell and core material may be coated with a conductive metal suchas silver or a conductive material such as carbon nanotubes or silverparticles may be incorporated into the polymer that is used toencapsulate the GaLMA particles at T-Junction 2.

When working with GaLMAs, two critical behaviors that must be taken intoaccount: First, in the presence of oxygen (air) GaLMAs spontaneouslyform a thin (1-2 nm) gallium oxide (GaO) skin on the surface of themetal that largely dictates the mechanical, rheological, and electricalattributes of the material. In the absence of the skin, GaLMAs behavemuch the same as their toxic counterpart, Mercury, in that they flowreadily and spontaneously assume those shapes which minimize freesurface energy. While the presence of the oxide film acts to stabilizethe LM droplets such that they are able to maintain small (millimeter orless) free-standing structures that stick readily to various substrates,the oxide leaves a residue on critical electrical components.Accordingly, by encapsulating the GaLMA in a polymeric microcapsule, thedetrimental effects of an oxide coating on the GaLMA particles may beavoided. Also, since the microcapsule material is deformable and iselectrically conductive, there is no formation of oxide residue on theelectrical components used with the deformable electrically conductivemicrocapsules made according to the disclosure.

Deformable yet mechanically resilient microcapsule

Applicants disclose a deformable yet mechanically resilient microcapsulehaving electrical properties comprising a gallium liquid metal alloycore having from about 60 to about 100 wt.% gallium and at least onealloying metal, and a polymeric shell encapsulating the liquid core,said polymeric shell having conductive properties, said polymeric shellcomprising a coating of an electrically conductive material and/orincorporating an electrically conductive material selected from thegroup consisting of silver particles, gold particles, copper particles,gallium particles, indium particles, gallium/indium alloy particles,mercury particles, aluminum particles, polythiophene,poly(ethylenedioxythiophene), polyaniline, graphene, carbon nanotubes,fullerenes, and mixtures thereof; preferably said electricallyconductive material is selected from the group consisting of silverparticles, gold particles, copper particles, gallium particles, indiumparticles, gallium/indium alloy particles, mercury particles, aluminumparticles, graphene, carbon nanotubes, and mixtures thereof; morepreferably said electrically conductive material is selected from thegroup consisting of silver particles, gold particles, copper particles,gallium particles, indium particles, gallium/indium alloy particles,mercury particles, aluminum particles and mixtures thereof; mostpreferably said electrically conductive material is selected from thegroup consisting of silver particles, gallium particles, indiumparticles, gallium/indium alloy particles and mixtures thereof.

Applicants disclose the deformable microcapsule of Paragraph 00028,wherein the gallium liquid metal alloy comprises gallium and indium.

Applicants disclose the deformable microcapsule of Paragraphs 00028through 00029 wherein the gallium liquid metal alloy further comprisestin.

Applicants disclose the deformable microcapsule of Paragraphs 00028through 00030 wherein the gallium liquid metal alloy comprises about 62wt.% to about 95 wt.% gallium; about 5 wt.% to about 22 wt.% indium; andabout 0 wt.% to about 16 wt.% Sn.

Applicants disclose the deformable microcapsule of Paragraph 00028,wherein the alloying metal is selected from the group consisting of tin,silver, gold, thallium, cesium, palladium, platinum, sodium, selenium,lithium, potassium, zinc, copper, cadmium, bismuth, indium, antimony,lead, and combinations of two or more of the foregoing.

Applicants disclose the deformable microcapsule of Paragraphs 00028through 00032 wherein the polymeric shell has a thickness ranging fromabout 10 to about 20 microns.

Applicants disclose the deformable microcapsule of Paragraphs 00028through 00033 wherein the core has a volume ranging from about 50 toabout 200 microliters.

Applicants disclose the deformable microcapsule of Paragraphs 00028through 00034 wherein the microcapsule has a mean particle diameterranging from about 100μm to about 1 mm.

Applicants disclose the deformable microcapsule of claim 1, wherein thepolymeric shell comprises a material selected from the group consistingof poly(alkyl-methacrylate), polysiloxane, polyurethane, poly(aniline),polypyrrole, polythiophene, poly(ethylenedioxythiophene),poly(p-phenylene vinylene), and mixtures thereof.

Method for making deformable microcapsules

Applicants disclose a method for making deformable microcapsulescontaining a gallium liquid metal alloy core, the method comprising thesteps of:

providing a double-T-junction apparatus having a first T-junction and asecond T-junction;

flowing at a rate of about 0.1 mL/Hr a gallium liquid metal alloyemulsion to the first T-junction containing a first aqueous carrierfluid to form first droplets in the first aqueous carrier fluid at arate of about 100 mL/Hr;

flowing at a rate of about 0.1 mL/Hr the first droplets to the secondT-junction containing an emulsion of a polymerizable material in asecond carrier fluid flowing at a rate of about 100 mL/Hr to form seconddroplets containing the first droplets as a core and the polymerizablematerial as a shell; and

polymerizing the polymerizable material to provide the deformablemicrocapsules containing the gallium liquid metal alloy core,

wherein the shell of the deformable microcapsules has conductiveproperties, said polymeric shell comprising a coating of an electricallyconductive material and/or incorporating an electrically conductivematerial selected from the group consisting of silver particles, goldparticles, copper particles, gallium particles, indium particles,gallium/indium alloy particles, mercury particles, aluminum particles,polythiophene, poly(ethylenedioxythiophene), polyaniline, graphene,carbon nanotubes, fullerenes, and mixtures thereof; preferably saidelectrically conductive material is selected from the group consistingof silver particles, gold particles, copper particles, galliumparticles, indium particles, gallium/indium alloy particles, mercuryparticles, aluminum particles, graphene, carbon nanotubes, and mixturesthereof; more preferably said electrically conductive material isselected from the group consisting of silver particles, gold particles,copper particles, gallium particles, indium particles, gallium/indiumalloy particles, mercury particles, aluminum particles and mixturesthereof; most preferably said electrically conductive material isselected from the group consisting of silver particles, galliumparticles, indium particles, gallium/indium alloy particles and mixturesthereof.

Applicants disclose the method of Paragraph 00036, wherein the galliumliquid metal alloy comprises gallium and indium.

Applicants disclose the method of Paragraphs 00036 through 00037 whereinthe gallium liquid metal alloy further comprises tin.

Applicants disclose the method of Paragraphs 00036 through 00038 whereinthe gallium liquid metal alloy comprises about 62 wt.% to about 95 wt.%gallium; about 5 wt.% to about 22 wt.% indium; and about 0 wt.% to about16 wt.% Sn.

Applicants disclose the method of Paragraphs 00036 through 00039 whereinthe alloying metal is selected from the group consisting of tin, silver,gold, thallium, cesium, palladium, platinum, sodium, selenium, lithium,potassium, zinc, copper, cadmium, bismuth, indium, antimony, lead, andcombinations of two or more of the foregoing.

Applicants disclose the method of Paragraphs 00036 through 00040 whereinthe microcapsules have a shell thickness ranging from about 10 to about20 microns.

Applicants disclose the method of Paragraphs 00036 through 00041 whereinthe core has a volume ranging from about 50 to about 200 microliters.

Applicants disclose the method of wherein Paragraphs 00036 through 00042the microcapsules have a mean particle diameter ranging from about 100μm to about 1 mm.

Applicants disclose the method of Paragraphs 00036 through 00043 whereinthe polymerizable material is selected from the group consisting ofpoly(alkyl-methacrylate), polysiloxane, polyurethane, poly(aniline),plypyrrole, polythiophene, poly(ethylenedioxythiophene),poly(p-phenylene vinylene), and mixtures thereof.

Deformable circuit component having electrical properties

Applicants disclose a deformable circuit component having electricalproperties comprising an electrical element containing microcapsuleshaving electrical properties, wherein the microcapsules comprise agallium liquid metal alloy core having from about 60 to about 85 wt.%gallium and at least one alloying metal, and a polymeric shellencapsulating the liquid core, said polymeric shell having conductiveproperties, said polymeric shell comprising a coating of an electricallyconductive material and/or incorporating an electrically conductivematerial selected from the group consisting of silver particles, goldparticles, copper particles, gallium particles, indium particles,gallium/indium alloy particles, mercury particles, aluminum particles,polythiophene, poly(ethylenedioxythiophene), polyaniline, graphene,carbon nanotubes, fullerenes, and mixtures thereof; preferably saidelectrically conductive material is selected from the group consistingof silver particles, gold particles, copper particles, galliumparticles, indium particles, gallium/indium alloy particles, mercuryparticles, aluminum particles, graphene, carbon nanotubes, and mixturesthereof; more preferably said electrically conductive material isselected from the group consisting of silver particles, gold particles,copper particles, gallium particles, indium particles, gallium/indiumalloy particles, mercury particles, aluminum particles and mixturesthereof; most preferably said electrically conductive material isselected from the group consisting of silver particles, galliumparticles, indium particles, gallium/indium alloy particles and mixturesthereof.

Applicants disclose the deformable circuit component of Paragraph 00045wherein the gallium liquid metal alloy comprises gallium and indium.

Applicants disclose the deformable circuit component of Paragraphs 00045through 00046 wherein the gallium liquid metal alloy further comprisestin.

Applicants disclose the deformable circuit component of Paragraphs 00045through 00047 wherein the gallium liquid metal alloy comprises about 62wt.% to about 95 wt.% gallium; about 5 wt.% to about 22 wt.% indium; andabout 0 wt.% to about 16 wt.% Sn.

Applicants disclose the deformable circuit component of Paragraphs 00045through 00048 wherein the alloying metal is selected from the groupconsisting of tin, silver, gold, thalium, cesium, palladium, platinum,sodium, selenium, lithium, potassium, zinc, copper, cadmium, bismuth,indium, antimony, lead, and combinations of two or more of theforegoing.

Applicants disclose the deformable circuit component of Paragraphs 00045through 00049 wherein the polymeric shell has a thickness ranging fromabout 10 to about 20 microns.

Applicants disclose the deformable circuit component of Paragraphs 00045through 00050 wherein the core has a volume ranging from about 50 toabout 200 microliters.

Applicants disclose the deformable circuit component of Paragraphs 00045through 00051 wherein the microcapsule has a mean particle diameterranging from about 100 μm to about 1 mm.

It is noted that, as used in this specification and the appended claims,the singular forms “a,” “an,” and “the,” include plural referents unlessexpressly and unequivocally limited to one referent. Thus, for example,reference to “an antioxidant” includes two or more differentantioxidants. As used herein, the term “include” and its grammaticalvariants are intended to be non-limiting, such that recitation of itemsin a list is not to the exclusion of other like items that can besubstituted or added to the listed items.

For the purposes of this specification and appended claims, unlessotherwise indicated, all numbers expressing quantities, percentages orproportions, and other numerical values used in the specification andclaims, are to be understood as being modified in all instances by theterm “about.” Accordingly, unless indicated to the contrary, thenumerical parameters set forth in the following specification andattached claims are approximations that can vary depending upon thedesired properties sought to be obtained by the present disclosure. Atthe very least, and not as an attempt to limit the application of thedoctrine of equivalents to the scope of the claims, each numericalparameter should at least be construed in light of the number ofreported significant digits and by applying ordinary roundingtechniques.

While particular embodiments have been described, alternatives,modifications, variations, improvements, and substantial equivalentsthat are or can be presently unforeseen can arise to applicants orothers skilled in the art. Accordingly, the appended claims as filed andas they can be amended are intended to embrace all such alternatives,modifications variations, improvements, and substantial equivalents.

What is claimed is:
 1. A deformable circuit component having electrical properties comprising an electrical element containing microcapsules having electrical properties, wherein the microcapsules comprise a gallium liquid metal alloy core having from about 60 to about 85 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties, said polymeric shell comprising a coating of an electrically conductive material and/or incorporating an electrically conductive material selected from the group consisting of silver particles, gold particles, copper particles, gallium particles, indium particles, gallium/indium alloy particles, mercury particles, aluminum particles, polythiophene, poly(ethylenedioxythiophene), polyaniline, graphene, carbon nanotubes, fullerenes, and mixtures thereof.
 2. The deformable circuit component of claim 1, wherein the gallium liquid metal alloy comprises gallium and indium.
 3. The deformable circuit component of claim 2, wherein the gallium liquid metal alloy further comprises tin.
 4. The deformable circuit component of claim 1, wherein the gallium liquid metal alloy comprises about 62 wt.% to about 95 wt.% gallium; about 5 wt.% to about 22 wt.% indium; and about 0 wt.% to about 16 wt.% Sn.
 5. The deformable circuit component of claim 1, wherein the alloying metal is selected from the group consisting of tin, silver, gold, thallium, cesium, palladium, platinum, sodium, selenium, lithium, potassium, zinc, copper, cadmium, bismuth, indium, antimony, lead, and combinations of two or more of the foregoing.
 6. The deformable circuit component of claim 1, wherein the polymeric shell has a thickness ranging from about 10 to about 20 microns.
 7. The deformable circuit component of claim 1, wherein the core has a volume ranging from about 50 to about 200 microliters.
 8. The deformable circuit component of claim 1, wherein the microcapsule has a mean particle diameter ranging from about 100 μm to about 1 mm.
 9. The deformable circuit component of claim 1, wherein said electrically conductive material is selected from the group consisting of silver particles, gold particles, copper particles, gallium particles, indium particles, gallium/indium alloy particles, mercury particles, aluminum particles, graphene, carbon nanotubes, and mixtures thereof.
 10. The deformable circuit component of claim 9, wherein said electrically conductive material is selected from the group consisting of silver particles, gold particles, copper particles, gallium particles, indium particles, gallium/indium alloy particles, mercury particles, aluminum particles and mixtures thereof.
 11. The deformable circuit component of claim 10, wherein said electrically conductive material is selected from the group consisting of silver particles, gallium particles, indium particles, gallium/indium alloy particles and mixtures thereof.
 12. The deformable circuit component of claim 1, wherein the polymeric shell comprises a material selected from the group consisting of poly(alkyl-methacrylate), polysiloxane, polyurethane, poly(aniline), polypyrrole, polythiophene, poly(ethylenedioxythiophene), poly(p-phenylene vinylene), and mixtures thereof. 